epoxy resin / laminating / fast-curing
Bodocure INF32 X Medium

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epoxy resin / laminating / fast-curing epoxy resin / laminating / fast-curing - Bodocure INF32 X Medium
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Characteristics

  • Type:

    epoxy

  • Applications:

    laminating

  • Properties:

    fast-curing

Description

BODOTEX Bodocure INF32 Series is developed as an Infusion Quality Epoxy Hardner. Bodocure INF 32 Series is a modified aliphatic and clyclo-aliphatic amine curing agent for epoxy. This curing agent is designed for applications requiring good temperature resistance and fine mechanical properties by post-curing at a relatively low temperature.

Bodocure INF 32 Series : X fast , Fast , Medium , Slow , X slow

System with Bodocure INF 32 GELS at 17-18°C, leaving the component ready for handling the next day.

System with Bodocure INF 32 cured at 50°C for 4h will result in a Tg of 70°C

System with Bodocure INF 32 cured at min 80°C for min 4h result in a Tg of max 90-100°C

BODOCURE INF32T6 Medium is another variant available from Bodotex . This curing system is Thixed.

The system cures excellently from about 17 – 18oC, but post-curing at a higher temperature is recommended.

Upon mixing at normal room temperature, BODOCURE INF 32 Series offers variable Potlifes from X fast - X Slow

Especially well-suited for manual and vacuum assisted laminations of larger items at normal room temperature.

We recommend post-curing at min. 50 Degrees C

Suited Epoxy Components :

BODOPOX 900
BODOPOX 1200
BODOPOX 5500