SP - High Modulus
Group: Gurit

Epoxy putty
SP 4832 SP - High Modulus

SP 4832 is a highly thixotropic, gap filling paste. It is a single component epoxy system designed to co-cure at moderate elevated temperature with SP-High Modulus's SE prepregs. The product is designed to be either applied between gel coat and prepreg in sharp recesses in order to bridge any large gaps between the two, or used as a highly effective low density core splicing adhesive. The colour is a very dark grey, to tone in with carbon prepregs.
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