Core material : foam DIAB
DIVINYCELL HP

With its unique combination of features - low weight /high strength, wide processing envelope and high temperature performance - prepreg compatible Divinycell HP is ideal for a wide range of applications in the marine, wind energy, transportation and industrial markets.

Temperature Performance
With its high processing temperature, Divinycell HP can be processed at a much higher temperature than other polymer core materials in general use, making it suitable for not only low but also medium temperature prepregs.

Its elevated temperature performance is not just beneficial to prepreg users. Its high residual strength and good dimensional stability also make it ideal for vacuum bagging, infusion and RTM (resin transfer molding). HP's elevated temperature performance also extends to the 'in service' life of the component. Divinycell HP will retain a high percentage of its mechanical properties despite long term exposure to high ambient temperatures.

Strength Performance
Divinycell HP exhibits at both ambient and elevated temperatures impressive compression and shear properties (normally the most important for a sandwich core material) that are better than other commonly used ‘elevated temperature’ core materials. The figures for shear strain show that HP has good ductility and energy absorption characteristics. Testing has shown that HP also outperforms linear cores in terms of slamming resistance.

Adhesion
Divinycell HP also excels is in adhesion. Peel tests have been performed using commonly used resin systems and prepregs with superior results to other cores used for prepregs.

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